About: Whiskers Growth on Thick Tin Layers and Various Types of Surfaces

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887591&isnumber=6887550
Description	The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed in order to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influence of the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compressive force under the action of permanent constant temperature at 50 degrees of Celsius. The transition from a highly widespread lead solders to lead-free solder alloy types meant many changes in the electrical industry. This transition has brought many technological phenomena that deserve our attention and they have to be still addressed in order to improve the quality and reliability of manufacturing printed circuit boards. One of them is the presence of small crystalline formations on the surfaces of tin and some tin alloys which are called whiskers. This article focuses on the influence of the used electrical materials and their surface treatments on the growth of tin whiskers. For our experiment were selected two lead-free solders with a high percentage representation of tin, by which are Sn95,5Ag3,8Cu0,7 (SAC 387) and Sn99Cu1. Solders were plated in a thick layer on the three types of metal substrates with various surface finishes. For this experiment was chosen copper, brass and phosphor bronze. The created samples were exposed to static mechanical stresses of compressive force under the action of permanent constant temperature at 50 degrees of Celsius. (en)
Title	Whiskers Growth on Thick Tin Layers and Various Types of Surfaces Whiskers Growth on Thick Tin Layers and Various Types of Surfaces (en)
skos:prefLabel	Whiskers Growth on Thick Tin Layers and Various Types of Surfaces Whiskers Growth on Thick Tin Layers and Various Types of Surfaces (en)
skos:notation	RIV/68407700:21230/14:00221826!RIV15-MSM-21230___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2015
http://linked.open...aciTvurceVysledku	Dušek, Karel Urbánek, Jan Plaček, Martin
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	56165
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/14:00221826
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Whiskers Growth; Solder; PCB; Surface Finishes (en)
http://linked.open.../riv/klicoveSlovo	PCB Solder Whiskers Growth Surface Finishes
http://linked.open...ontrolniKodProRIV	[D6434F7C5571]
http://linked.open...v/mistoKonaniAkce	Drážďany
http://linked.open...i/riv/mistoVydani	New York
http://linked.open...i/riv/nazevZdroje	37th Int. Spring Seminar on Electronics Technology
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2014
http://linked.open...iv/tvurceVysledku	Dušek, Karel Urbánek, Jan Plaček, Martin
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2014-05-07 (xsd:date)
number of pages	5 (xsd:int)
http://bibframe.org/vocab/doi	10.1109/ISSE.2014.6887591
http://purl.org/ne...btex#hasPublisher	IEEE
https://schema.org/isbn	978-1-4799-4455-2
http://localhost/t...ganizacniJednotka	21230

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