About: Influence of Humidity on Voids Formation inside the Solder Joint

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint structure. Experimental part was carried on testing samples, where we used three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow technology (hot air, vapor phase and infra radiation reflow technology) and three types of humidity environments. The inspection was made on X-ray and following diagnostic was made by image analysis with special software. Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint structure. Experimental part was carried on testing samples, where we used three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow technology (hot air, vapor phase and infra radiation reflow technology) and three types of humidity environments. The inspection was made on X-ray and following diagnostic was made by image analysis with special software. (en)
Title	Influence of Humidity on Voids Formation inside the Solder Joint Influence of Humidity on Voids Formation inside the Solder Joint (en)
skos:prefLabel	Influence of Humidity on Voids Formation inside the Solder Joint Influence of Humidity on Voids Formation inside the Solder Joint (en)
skos:notation	RIV/68407700:21230/13:00213097!RIV14-MSM-21230___
http://linked.open...avai/predkladatel	Fakulta elektrotechnická
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Vlach, Jan Dušek, Karel Hájková, Lenka Brejcha, Michal Pospíšil, Ladislav Žák, Pavel
http://linked.open.../riv/druhVysledku	O - Ostatní výsledky nezařaditelné do žádného z výše uvedených druhů výsledku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	79794
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/13:00213097
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Solder joint; humidity; voids (en)
http://linked.open.../riv/klicoveSlovo	humidity Solder joint voids
http://linked.open...ontrolniKodProRIV	[1DE396AFE8B0]
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	6 (xsd:int)
http://linked.open...cetTvurcuVysledku	6 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...iv/tvurceVysledku	Brejcha, Michal Dušek, Karel Hájková, Lenka Pospíšil, Ladislav Žák, Pavel Vlach, Jan
http://bibframe.org/vocab/doi	10.1166/asem.2013.1321
http://localhost/t...ganizacniJednotka	21230

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