About: The Growth of Whiskers on Thick Layers of Lead-Free Solders

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This research focuses on the possible emergence of tin crystalline formations on thick layers of lead-free solders. For this test were selected two lead-free solders, which are commonly used in the electronics industry, 99Sn1Cu and 96Sn3,8Ag0,2Cu. The created samples were exposed to any mechanical static stress and suitable climatic conditions under the defined climatic conditions. The aim was to verify whether under the conditions that occur in many electrical devices, there is the growth of whiskers. This research focuses on the possible emergence of tin crystalline formations on thick layers of lead-free solders. For this test were selected two lead-free solders, which are commonly used in the electronics industry, 99Sn1Cu and 96Sn3,8Ag0,2Cu. The created samples were exposed to any mechanical static stress and suitable climatic conditions under the defined climatic conditions. The aim was to verify whether under the conditions that occur in many electrical devices, there is the growth of whiskers. (en)
Title	The Growth of Whiskers on Thick Layers of Lead-Free Solders The Growth of Whiskers on Thick Layers of Lead-Free Solders (en)
skos:prefLabel	The Growth of Whiskers on Thick Layers of Lead-Free Solders The Growth of Whiskers on Thick Layers of Lead-Free Solders (en)
skos:notation	RIV/68407700:21230/13:00210871!RIV14-MSM-21230___
http://linked.open...avai/predkladatel	Fakulta elektrotechnická
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Marcinka, Ondřej Konečná, Zuzana Plaček, Martin Žák, Pavel
http://linked.open.../riv/druhVysledku	O - Ostatní výsledky nezařaditelné do žádného z výše uvedených druhů výsledku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	76942
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/13:00210871
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Whiskers; Lead-Free Solders; Thick Layers (en)
http://linked.open.../riv/klicoveSlovo	Whiskers Lead-Free Solders Thick Layers
http://linked.open...ontrolniKodProRIV	[5B5C0AE557D8]
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...iv/tvurceVysledku	Žák, Pavel Konečná, Zuzana Plaček, Martin Marcinka, Ondřej
http://localhost/t...ganizacniJednotka	21230

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