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Description
  • A key process in surface mount technology is soldering, when a metallurgical joint is formed between the molten solder and metal surfaces. Solders in molten state have to show good spreading action together with good wetting of substrate. Each solder has a different degree of spreading on the metal surface. Degree of spreading mainly depends on combination of flux, solder alloy, soldered substrate. This study is focused to investigate effect of reflow technology and PCBs surface finishes on spreading of molten solders.
  • A key process in surface mount technology is soldering, when a metallurgical joint is formed between the molten solder and metal surfaces. Solders in molten state have to show good spreading action together with good wetting of substrate. Each solder has a different degree of spreading on the metal surface. Degree of spreading mainly depends on combination of flux, solder alloy, soldered substrate. This study is focused to investigate effect of reflow technology and PCBs surface finishes on spreading of molten solders. (en)
Title
  • Effect of reflow technology and surface finishes of PCB on solder spreading
  • Effect of reflow technology and surface finishes of PCB on solder spreading (en)
skos:prefLabel
  • Effect of reflow technology and surface finishes of PCB on solder spreading
  • Effect of reflow technology and surface finishes of PCB on solder spreading (en)
skos:notation
  • RIV/68407700:21230/13:00210827!RIV15-MSM-21230___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • I, S
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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  • 71703
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/13:00210827
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • reflow technology; surface finishes; PCB; solder spreading (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [6C1E2D5AF800]
http://linked.open...v/mistoKonaniAkce
  • Alba Iulia
http://linked.open...i/riv/mistoVydani
  • New York
http://linked.open...i/riv/nazevZdroje
  • Proceedings of the International Spring Seminar on Electronic Technology
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http://linked.open...UplatneniVysledku
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  • Dušek, Karel
  • Vávra, Jan
  • Rudajevová, A.
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
issn
  • 2161-2528
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2013.6648230
http://purl.org/ne...btex#hasPublisher
  • IEEE
https://schema.org/isbn
  • 9781479900367
http://localhost/t...ganizacniJednotka
  • 21230
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