About: MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert – nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm. Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such as type of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert – nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity. For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples is given by different diameter of the samples, when we used copper wire with diameters 0.3 mm, 0.4 mm and 0.7 mm. (en)
Title	MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY (en)
skos:prefLabel	MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY (en)
skos:notation	RIV/68407700:21230/13:00210400!RIV14-MSM-21230___
http://linked.open...avai/predkladatel	Fakulta elektrotechnická
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Růžička, Daniel Dušek, Karel Beshajová Pelikánová, Ivana
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	86756
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/13:00210400
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	solder alloys; thermal capacity; wetting balance method (en)
http://linked.open.../riv/klicoveSlovo	solder alloys wetting balance method thermal capacity
http://linked.open...ontrolniKodProRIV	[167994CB1D28]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	Proceedings - Electronic Devices and Systems - EDS '13
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...iv/tvurceVysledku	Beshajová Pelikánová, Ivana Dušek, Karel Růžička, Daniel
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2013-06-26 (xsd:date)
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
https://schema.org/isbn	9788021447547
http://localhost/t...ganizacniJednotka	21230

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