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  • This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400 lumen retrofit SSL lamps. Presented design methodology can be used for other high power SSL lamp designs. The performance of new LED board designs were evaluated by numerical modeling. Modeling methodology was proven by measurement on reference FR4 LED board. Thermal performance was compared by extracting of LED boards thermal resistances and thermal stress has been inspected considering the widest temperature operating range according to standards (-40 to +125 °C). Thermo-mechanical and reliability analysis have been performed to study parameters of each LED board technology, using thermal boundary conditions extracted from the thermal simulation of a whole LED lamp. Elastic-plastic analysis with temperature dependent stress-strain material properties has been performed. The objective of the work is to optimize not only the thermal management by thermal simulation of LED boards, but also to find potential problems from mechanical failure point of view and to present a methodology to design SSL LED boards for reliability
  • This work presents a comparison of various LED board technologies from thermal, mechanical and reliability point of view provided by an accurate 3-D modelling. LED boards are proposed as a possible technology replacement of FR4 LED boards used in 400 lumen retrofit SSL lamps. Presented design methodology can be used for other high power SSL lamp designs. The performance of new LED board designs were evaluated by numerical modeling. Modeling methodology was proven by measurement on reference FR4 LED board. Thermal performance was compared by extracting of LED boards thermal resistances and thermal stress has been inspected considering the widest temperature operating range according to standards (-40 to +125 °C). Thermo-mechanical and reliability analysis have been performed to study parameters of each LED board technology, using thermal boundary conditions extracted from the thermal simulation of a whole LED lamp. Elastic-plastic analysis with temperature dependent stress-strain material properties has been performed. The objective of the work is to optimize not only the thermal management by thermal simulation of LED boards, but also to find potential problems from mechanical failure point of view and to present a methodology to design SSL LED boards for reliability (en)
Title
  • Design methodologies for reliability of SSL LED boards
  • Design methodologies for reliability of SSL LED boards (en)
skos:prefLabel
  • Design methodologies for reliability of SSL LED boards
  • Design methodologies for reliability of SSL LED boards (en)
skos:notation
  • RIV/68407700:21230/13:00205480!RIV14-MSM-21230___
http://linked.open...avai/predkladatel
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(7H10017), S
http://linked.open...iv/cisloPeriodika
  • 8
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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http://linked.open...titaPredkladatele
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  • 68582
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/13:00205480
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • SSL lightning; LED boards; reliability (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • NL - Nizozemsko
http://linked.open...ontrolniKodProRIV
  • [6BDF684A8443]
http://linked.open...i/riv/nazevZdroje
  • Microelectronics Reliability
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 53
http://linked.open...iv/tvurceVysledku
  • Husák, Miroslav
  • Formánek, Jan
  • Jakovenko, Jiří
  • Bancken, P.
  • Bolt, P. J.
  • Kunen, J.
  • Jorda, X.
  • Perpina, X.
  • Vellvehi, M.
  • Gasse, A.
  • Werkhoven, R. J.
http://linked.open...ain/vavai/riv/wos
  • 000322292100005
issn
  • 0026-2714
number of pages
http://bibframe.org/vocab/doi
  • 10.1016/j.microrel.2013.02.017
http://localhost/t...ganizacniJednotka
  • 21230
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