About: Pressure Sensor Package Simulation in Large Temperature Range

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.imaps.cz/eds/
Description	Modeling and results of thermal cycling measurement of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package shows that the stresses in the electrical interconnections are close to the yield stress of silver at 20 °C. The stress free temperature for simulation was set to 850 °C. Temperature induced stress and strains in the packaging and a fatigue simulation are performed. The package is generic and can be converted to fit most geometries and high temperature applications. Modeling and results of thermal cycling measurement of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package shows that the stresses in the electrical interconnections are close to the yield stress of silver at 20 °C. The stress free temperature for simulation was set to 850 °C. Temperature induced stress and strains in the packaging and a fatigue simulation are performed. The package is generic and can be converted to fit most geometries and high temperature applications. (en)
Title	Pressure Sensor Package Simulation in Large Temperature Range Pressure Sensor Package Simulation in Large Temperature Range (en)
skos:prefLabel	Pressure Sensor Package Simulation in Large Temperature Range Pressure Sensor Package Simulation in Large Temperature Range (en)
skos:notation	RIV/68407700:21230/12:00198667!RIV13-MSM-21230___
http://linked.open...avai/predkladatel	Fakulta elektrotechnická
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Formánek, Jan Jakovenko, Jiří
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	161445
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/12:00198667
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	pressure sensor; package; large temperature range; thermal cycling; simulation; measurement; stress; lifetime; nano-silver (en)
http://linked.open.../riv/klicoveSlovo	lifetime pressure sensor package measurement simulation stress thermal cycling large temperature range nano-silver
http://linked.open...ontrolniKodProRIV	[4AD24262E4DB]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	Proceedings of Electronic Devices and Systems EDS 2012
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Formánek, Jan Jakovenko, Jiří Laposa, Alexandr Brinkfeldt, K.
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2012-06-28 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
https://schema.org/isbn	978-80-214-4539-0
http://localhost/t...ganizacniJednotka	21230
is http://linked.open...avai/riv/vysledek of	Pressure Sensor Package Simulation in Large Temperature Range

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