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Description
  • Main role of each LED board is to transport heat from LED die to heat sink and keep the thermal stresses in all layers as low as possible. Thermal stress has been studied for wide temperature range that can affect the LED boards (-40 to +125oC). Thermal stress cycles that can lead to the LED board failure have been calculated. Simulations have been completed with ANSYS structural analysis where temperature dependent stress-strain material properties have been taken into account.
  • Main role of each LED board is to transport heat from LED die to heat sink and keep the thermal stresses in all layers as low as possible. Thermal stress has been studied for wide temperature range that can affect the LED boards (-40 to +125oC). Thermal stress cycles that can lead to the LED board failure have been calculated. Simulations have been completed with ANSYS structural analysis where temperature dependent stress-strain material properties have been taken into account. (en)
Title
  • Design and life time evaluation of various LED boards for SSL lamp
  • Design and life time evaluation of various LED boards for SSL lamp (en)
skos:prefLabel
  • Design and life time evaluation of various LED boards for SSL lamp
  • Design and life time evaluation of various LED boards for SSL lamp (en)
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  • RIV/68407700:21230/12:00195972!RIV13-MV0-21230___
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  • P(VG20102015015)
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  • 130256
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  • RIV/68407700:21230/12:00195972
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  • SSL; LED lamp; lifetime (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [B6F6D6F505AC]
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  • Brno
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  • Brno
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  • Proceedings of Electronic Devices and Systems EDS 2012
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  • Husák, Miroslav
  • Formánek, Jan
  • Jakovenko, Jiří
  • Bancken, P.
  • Bolt, P. J.
  • Kunen, J.
  • Werkhoven, R.
  • Kotě, Vlastimil
  • Molata, Vladimír
  • Nápravník, Tomáš
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  • Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
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  • 978-80-214-4539-0
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  • 21230
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