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Description
| - The EC directive 2002/95/ES (RoHS) limited (with few exceptions) the use of lead in electronic production, especially in solders and surface finishes. This brought significant changes in their reliability. The electroplated tin coating is currently among the most widely used surface finishes in the electronic industry, appearing everywhere from the coating of solder pads on SMD devices to corrosion prevention coating on large containers. The tin is usually deposited galvanically, in a layer 10mm thick, often with a yet thinner interlayer between the tin and base material. The most common base materials are copper, brass and bronze. Usually the connector or component lead is cut, bent or otherwise shaped either before the coating or after it. This combination of materials and mechanical stress can lead to appearance of one important risk factor: tin whiskers.
- The EC directive 2002/95/ES (RoHS) limited (with few exceptions) the use of lead in electronic production, especially in solders and surface finishes. This brought significant changes in their reliability. The electroplated tin coating is currently among the most widely used surface finishes in the electronic industry, appearing everywhere from the coating of solder pads on SMD devices to corrosion prevention coating on large containers. The tin is usually deposited galvanically, in a layer 10mm thick, often with a yet thinner interlayer between the tin and base material. The most common base materials are copper, brass and bronze. Usually the connector or component lead is cut, bent or otherwise shaped either before the coating or after it. This combination of materials and mechanical stress can lead to appearance of one important risk factor: tin whiskers. (en)
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Title
| - Tin coating of connectors - reliability risk for electrical equipment
- Tin coating of connectors - reliability risk for electrical equipment (en)
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skos:prefLabel
| - Tin coating of connectors - reliability risk for electrical equipment
- Tin coating of connectors - reliability risk for electrical equipment (en)
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skos:notation
| - RIV/68407700:21230/11:00183627!RIV12-MSM-21230___
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http://linked.open...avai/predkladatel
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/68407700:21230/11:00183627
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - Connectors; Materials; Reliability; Stress; Surface treatment; Tin (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 34th International Spring Seminar on Electronics Technology
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Kudláček, Ivan
- Tučan, Marek
- Žák, Pavel
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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number of pages
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http://bibframe.org/vocab/doi
| - 10.1109/ISSE.2011.6053864
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http://purl.org/ne...btex#hasPublisher
| - Technická univerzita v Košiciach
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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is http://linked.open...avai/riv/vysledek
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