About: Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used. Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used. (en)
Title	Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive (en)
skos:prefLabel	Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive (en)
skos:notation	RIV/68407700:21230/10:00173027!RIV12-MSM-21230___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Pilarčíková, Ivana Bušek, David Mach, Pavel
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	292779
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/10:00173027
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	thermomechanical analysis; electrically conductive adhesive; carbon nanotubes; silver nanoparticles; colloidal silver (en)
http://linked.open.../riv/klicoveSlovo	colloidal silver thermomechanical analysis carbon nanotubes electrically conductive adhesive silver nanoparticles
http://linked.open...ontrolniKodProRIV	[B0D611389A6F]
http://linked.open...v/mistoKonaniAkce	Warsaw
http://linked.open...i/riv/mistoVydani	New York
http://linked.open...i/riv/nazevZdroje	33rd International Spring Seminar on Electronics Technology
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2010
http://linked.open...iv/tvurceVysledku	Bušek, David Mach, Pavel Pilarčíková, Ivana
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2010-05-12 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Characterization of materials
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	IEEE
https://schema.org/isbn	978-1-4244-7849-1
http://localhost/t...ganizacniJednotka	21230
is http://linked.open...avai/riv/vysledek of	Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive

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