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Description
  • This article deals with the mechanical stress of lead and lead free soldered joints. During usage of electrical equipment are found structural changes of soldered joints, which can lead to cracks or failure of the solder joints. In this article, the changes of the electrical resistance of dynamic and static stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95,5Ag4Cu0,5) are compared.
  • This article deals with the mechanical stress of lead and lead free soldered joints. During usage of electrical equipment are found structural changes of soldered joints, which can lead to cracks or failure of the solder joints. In this article, the changes of the electrical resistance of dynamic and static stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95,5Ag4Cu0,5) are compared. (en)
Title
  • Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints
  • Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints (en)
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  • Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints
  • Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints (en)
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  • RIV/68407700:21230/10:00171625!RIV12-MSM-21230___
http://linked.open...avai/riv/aktivita
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  • Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat
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  • 251426
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  • RIV/68407700:21230/10:00171625
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  • Solder joint, Mechanical Stress (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [81A6D98C3541]
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  • Warsaw
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  • New York
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  • 33rd International Spring Seminar on Electronics Technology
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  • Dušek, Karel
  • Urbánek, M.
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http://linked.open...n/vavai/riv/zamer
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2010.5547292
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  • IEEE
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  • 978-1-4244-7849-1
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  • 21230
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