About: Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges     Goto   Sponge   NotDistinct   Permalink

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  • Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution.
  • Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about 8 eV. The ion saturated current is highest in dual-HiPIMS discharge (5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution. (en)
Title
  • Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
  • Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges (en)
skos:prefLabel
  • Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
  • Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges (en)
skos:notation
  • RIV/68378271:_____/11:00373839!RIV12-AV0-68378271
http://linked.open...avai/predkladatel
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  • P(1M06002), P(GAP205/11/0386), P(GP202/09/P159), P(KAN301370701), S, Z(AV0Z10100522), Z(MSM0021620834)
http://linked.open...iv/cisloPeriodika
  • 2-3
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http://linked.open...aciTvurceVysledku
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  • 201578
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  • RIV/68378271:_____/11:00373839
http://linked.open...riv/jazykVysledku
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  • dual magnetron; Ti-Cu film; HiPIMS; diagnostics; ion energy (en)
http://linked.open.../riv/klicoveSlovo
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  • DE - Spolková republika Německo
http://linked.open...ontrolniKodProRIV
  • [51C9ED8BF1B9]
http://linked.open...i/riv/nazevZdroje
  • European Physical Journal D
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 64
http://linked.open...iv/tvurceVysledku
  • Hubička, Zdeněk
  • Bogdanowicz, R.
  • Drache, S.
  • Hippler, R.
  • Straňák, V.
  • Čada, Martin
  • Tichý, M.
  • Wulff, H.
http://linked.open...ain/vavai/riv/wos
  • 000296630800029
http://linked.open...n/vavai/riv/zamer
issn
  • 1434-6060
number of pages
http://bibframe.org/vocab/doi
  • 10.1140/epjd/e2011-20393-7
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