About: Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Experiments were conducted to determine an effect of ECAP pressing on the creep behavior of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373, 473 and 573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. The results demonstrate that the n of coarse-grained material increases from the value n 6 measured at 573 K to the value of n 14 determined at 373 K. However, the values of stress exponent n of UFG material were about 6 at 373, 473 and 573 K over relatively wide range of strain rates. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). It was found that the change of grain size and number of high-angle grain boundaries in the microstructure influence the transition from power law behavior region to the power law breakdown and that creep behavior of UFG Cu is influenced by grain boundary sliding and cavitation. Experiments were conducted to determine an effect of ECAP pressing on the creep behavior of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373, 473 and 573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. The results demonstrate that the n of coarse-grained material increases from the value n 6 measured at 573 K to the value of n 14 determined at 373 K. However, the values of stress exponent n of UFG material were about 6 at 373, 473 and 573 K over relatively wide range of strain rates. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). It was found that the change of grain size and number of high-angle grain boundaries in the microstructure influence the transition from power law behavior region to the power law breakdown and that creep behavior of UFG Cu is influenced by grain boundary sliding and cavitation. (en)
Title	Influence of Grain Size on Creep Behavior of Copper Processed by ECAP Influence of Grain Size on Creep Behavior of Copper Processed by ECAP (en)
skos:prefLabel	Influence of Grain Size on Creep Behavior of Copper Processed by ECAP Influence of Grain Size on Creep Behavior of Copper Processed by ECAP (en)
skos:notation	RIV/68081723:_____/12:00386294!RIV13-GA0-68081723
http://linked.open...avai/predkladatel	Ústav fyziky materiálů AVČR, v.v.i.
http://linked.open...avai/riv/aktivita	I P
http://linked.open...avai/riv/aktivity	I, P(GPP108/10/P469)
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Kvapilová, Marie Svoboda, Milan Sklenička, Václav Dvořák, Jiří Král, Petr
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Ústav fyziky materiálů AV ČR, v. v. i.
http://linked.open...dnocenehoVysledku	141424
http://linked.open...ai/riv/idVysledku	RIV/68081723:_____/12:00386294
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	ultrafine-grained microstructure; equal-channel angular pressing (ECAP); grain boundary sliding; copper (en)
http://linked.open.../riv/klicoveSlovo	copper ultrafine-grained microstructure grain boundary sliding equal-channel angular pressing (ECAP)
http://linked.open...ontrolniKodProRIV	[87EB93763422]
http://linked.open...v/mistoKonaniAkce	Kyoto
http://linked.open...i/riv/mistoVydani	Sendai
http://linked.open...i/riv/nazevZdroje	Creep and Fracture of Engineering Materials and Structure
http://linked.open...in/vavai/riv/obor	JJ
http://linked.open...ichTvurcuVysledku	5 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Influence of initial crystallographic orientation on creep behaviour of SPD materials
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Dvořák, Jiří Král, Petr Kvapilová, Marie Sklenička, Václav Svoboda, Milan
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-05-27 (xsd:date)
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	The Japan Institute of Metals
https://schema.org/isbn	978-4-88903-407-3
is http://linked.open...avai/riv/vysledek of	Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

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