About: Interaction of Silver Nanopowder with Cooper Substrate

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. (en)
Title	Interaction of Silver Nanopowder with Cooper Substrate Interaction of Silver Nanopowder with Cooper Substrate (en)
skos:prefLabel	Interaction of Silver Nanopowder with Cooper Substrate Interaction of Silver Nanopowder with Cooper Substrate (en)
skos:notation	RIV/68081723:_____/11:00362863!RIV12-AV0-68081723
http://linked.open...avai/predkladatel	Ústav fyziky materiálů AVČR, v.v.i.
http://linked.open...avai/riv/aktivita	I P Z
http://linked.open...avai/riv/aktivity	I, P(GA106/09/0700), Z(AV0Z20410507)
http://linked.open...iv/cisloPeriodika	-
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Buršík, Jiří
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Ústav fyziky materiálů AV ČR, v. v. i.
http://linked.open...dnocenehoVysledku	205246
http://linked.open...ai/riv/idVysledku	RIV/68081723:_____/11:00362863
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	silver; copper; sintering (en)
http://linked.open.../riv/klicoveSlovo	copper silver sintering
http://linked.open...odStatuVydavatele	BA - Bosna a Hercegovina
http://linked.open...ontrolniKodProRIV	[B4D237881313]
http://linked.open...i/riv/nazevZdroje	Science of Sintering
http://linked.open...in/vavai/riv/obor	JG
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	5 (xsd:int)
http://linked.open...vavai/riv/projekt	Thermodynamics and microstructure of environmentally friendly nanoparticle solders
http://linked.open...UplatneniVysledku	2011
http://linked.open...v/svazekPeriodika	43
http://linked.open...iv/tvurceVysledku	Brož, P. Buršík, Jiří Buršíková, V. Sopoušek, J. Zálešák, J.
http://linked.open...ain/vavai/riv/wos	000294191600004
http://linked.open...n/vavai/riv/zamer	Physical properties of advanced materials in relation to their microstructure and processing
issn	0350-820X
number of pages	6 (xsd:int)
is http://linked.open...avai/riv/vysledek of	Interaction of Silver Nanopowder with Cooper Substrate Interaction of Silver Nanopowder with Cooper Substrate

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