About: Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180°C. The dwell times were in the range of 10 to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1°. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing. Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180°C. The dwell times were in the range of 10 to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1°. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing. (en)
Title	Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction (en)
skos:prefLabel	Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction (en)
skos:notation	RIV/68081723:_____/10:00353414!RIV11-AV0-68081723
http://linked.open...avai/riv/aktivita	P S Z
http://linked.open...avai/riv/aktivity	P(1QS200410502), P(2E08017), S, Z(AV0Z20410507), Z(MSM0021630508)
http://linked.open...iv/cisloPeriodika	2
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Kunz, Ludvík
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Ústav fyziky materiálů AV ČR, v. v. i.
http://linked.open...dnocenehoVysledku	290860
http://linked.open...ai/riv/idVysledku	RIV/68081723:_____/10:00353414
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	ultra-fine grained copper; thermal stability of microstructure; electron back scattering diffraction; grain size; texture (en)
http://linked.open.../riv/klicoveSlovo	texture grain size ultra-fine grained copper electron back scattering diffraction thermal stability of microstructure
http://linked.open...odStatuVydavatele	JP - Japonsko
http://linked.open...ontrolniKodProRIV	[AC130831B6E5]
http://linked.open...i/riv/nazevZdroje	Materials Transactions
http://linked.open...in/vavai/riv/obor	JG
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...vavai/riv/projekt	Procedures and Methods to Increase Number of Researchers Properties of engineering materials under development applicable in the near future in traffic, medicine and power generating industry
http://linked.open...UplatneniVysledku	2010
http://linked.open...v/svazekPeriodika	51
http://linked.open...iv/tvurceVysledku	Kunz, Ludvík Man, O. Pantělejev, L.
http://linked.open...ain/vavai/riv/wos	000276538900003
http://linked.open...n/vavai/riv/zamer	Physical properties of advanced materials in relation to their microstructure and processing Anorganické nanomateriály a nanostruktury: vytváření, analýza, vlastnosti
issn	1345-9678
number of pages	5 (xsd:int)
is http://linked.open...avai/riv/vysledek of	Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction

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