About: Creep in copper dispersion strengthened with alumina particles (ODS copper).

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About: Creep in copper dispersion strengthened with alumina particles (ODS copper). Goto Sponge NotDistinct Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The creep behaviour of ODS copper is investigated in two distinctly different temperature intervals. In both intervals creep exhibits threshold behaviour; the true threshold stress decreases with increasing temperature. In the lower temperature interval (673ů773 K) the creep strain rate is dislocation core diffusion controlled and the true stress exponent is close to 7. In the higher temperature interval (923ů1023 K) creep is controlled by the lattice self-diffusion and the true stress exponent is close to 5. In both temperature intervals the apparent activation energies are much higher than the respective activation enthalpies of diffusion, i.e. the true activation energies of creep, and the apparent stress exponents are much higher than the respective true stress exponents. The differences of apparent and true activation energies are fully explained by the observed temperature dependences of the true threshold stresses. The differences between the apparent and the true stress exponents are shown to The creep behaviour of ODS copper is investigated in two distinctly different temperature intervals. In both intervals creep exhibits threshold behaviour; the true threshold stress decreases with increasing temperature. In the lower temperature interval (673ů773 K) the creep strain rate is dislocation core diffusion controlled and the true stress exponent is close to 7. In the higher temperature interval (923ů1023 K) creep is controlled by the lattice self-diffusion and the true stress exponent is close to 5. In both temperature intervals the apparent activation energies are much higher than the respective activation enthalpies of diffusion, i.e. the true activation energies of creep, and the apparent stress exponents are much higher than the respective true stress exponents. The differences of apparent and true activation energies are fully explained by the observed temperature dependences of the true threshold stresses. The differences between the apparent and the true stress exponents are shown to (en)
Title	Creep in copper dispersion strengthened with alumina particles (ODS copper). Creep in copper dispersion strengthened with alumina particles (ODS copper). (en)
skos:prefLabel	Creep in copper dispersion strengthened with alumina particles (ODS copper). Creep in copper dispersion strengthened with alumina particles (ODS copper). (en)
skos:notation	RIV/68081723:_____/03:07033036!RIV/2004/AV0/A07004/N
http://linked.open.../vavai/riv/strany	170;179
http://linked.open...avai/riv/aktivita	P Z
http://linked.open...avai/riv/aktivity	P(IBS2041001), Z(AV0Z2041904)
http://linked.open...iv/cisloPeriodika	1-2
http://linked.open...vai/riv/dodaniDat	2004
http://linked.open...aciTvurceVysledku	Čadek, Josef Kuchařová, Květa
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Ústav fyziky materiálů AV ČR, v. v. i.
http://linked.open...dnocenehoVysledku	602388
http://linked.open...ai/riv/idVysledku	RIV/68081723:_____/03:07033036
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Copper alloy; Creep; Powder processing (en)
http://linked.open.../riv/klicoveSlovo	Creep Powder processing Copper alloy
http://linked.open...odStatuVydavatele	NL - Nizozemsko
http://linked.open...ontrolniKodProRIV	[7A702339B80F]
http://linked.open...i/riv/nazevZdroje	Materials Science and Engineering A. A
http://linked.open...in/vavai/riv/obor	JI
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...ocetUcastnikuAkce	0 (xsd:int)
http://linked.open...nichUcastnikuAkce	0 (xsd:int)
http://linked.open...vavai/riv/projekt	Degradation of properties and lifetime assessment of engineering materials under mechanical loading
http://linked.open...UplatneniVysledku	2003
http://linked.open...v/svazekPeriodika	348
http://linked.open...iv/tvurceVysledku	Kuchařová, Květa Čadek, Josef Zhu, S. J.
http://linked.open...n/vavai/riv/zamer	Behavior and properties of metallic and non-metallic materials in relation to their structure, research on processes leading to degradation of material quality
issn	0921-5093
number of pages	10 (xsd:int)

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