About: High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.     Goto   Sponge   NotDistinct   Permalink

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  • The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses.
  • The creep behaviour in ODS Copper is investigated in two distincly different temperature intervals,the lower temperature interval LTI(673-773 K) and the higher temperature interval HTI(923-1023 K).In both intervals the creep exhibits threshold behaviour. In LTI, the creep strain rate is controlled by the dislocation core diffusion in the ODS matrix and the true stress exponent is close to 7. In HTI the creep strain rate is found to be controlled by lattice self-diffusion in the ODS matrix and the true exponent is 5. In both intervals the differences of apparent and true activation energies are explained by observed temperature dependences of true threshold stresses. (en)
Title
  • High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.
  • High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles. (en)
skos:prefLabel
  • High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles.
  • High Temperature Creep Behaviour of Copper Dispersion Strengthened with Fine Alumina Particles. (en)
skos:notation
  • RIV/68081723:_____/02:07023114!RIV/2003/AV0/A07003/N
http://linked.open.../vavai/riv/strany
  • 357;378
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(IBS2041001), Z(AV0Z2041904)
http://linked.open...iv/cisloPeriodika
  • 4
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
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http://linked.open...dnocenehoVysledku
  • 647564
http://linked.open...ai/riv/idVysledku
  • RIV/68081723:_____/02:07023114
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Copper alloy; Creep; Powder processing (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • CZ - Česká republika
http://linked.open...ontrolniKodProRIV
  • [555D44CD7484]
http://linked.open...i/riv/nazevZdroje
  • Acta Technica ČSAV
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...ocetUcastnikuAkce
http://linked.open...nichUcastnikuAkce
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 47
http://linked.open...iv/tvurceVysledku
  • Kuchařová, Květa
  • Čadek, Josef
  • Zhu, S. J.
http://linked.open...n/vavai/riv/zamer
issn
  • 0001-7043
number of pages
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