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  • Ni and Pt are common contact materials for n-type and p-type of silicon carbide, respectively. As deposited metals have to be annealed at least at 950C. Both metals react with SiC and silicides are created as a result; thus a certain region of subcontact SiC is decomposed. The mentioned reaction destroys semiconductor material under an ohmic contact and thus can influence behavior of the whole semiconductor structure. A silicon layer inserted in the metallization can reduce reactions of metals with SiC and minimize the decomposition of SiC. The aim of the contribution is testing of Si interlayer on electrical parameters of Ni/SiC and Pt/SiC structures. Both metallizations are prepared on n-type of SiC.
  • Ni and Pt are common contact materials for n-type and p-type of silicon carbide, respectively. As deposited metals have to be annealed at least at 950C. Both metals react with SiC and silicides are created as a result; thus a certain region of subcontact SiC is decomposed. The mentioned reaction destroys semiconductor material under an ohmic contact and thus can influence behavior of the whole semiconductor structure. A silicon layer inserted in the metallization can reduce reactions of metals with SiC and minimize the decomposition of SiC. The aim of the contribution is testing of Si interlayer on electrical parameters of Ni/SiC and Pt/SiC structures. Both metallizations are prepared on n-type of SiC. (en)
Title
  • Effects of Si interlayer on nickel and platinum ohmic contacts for n-type SiC
  • Effects of Si interlayer on nickel and platinum ohmic contacts for n-type SiC (en)
skos:prefLabel
  • Effects of Si interlayer on nickel and platinum ohmic contacts for n-type SiC
  • Effects of Si interlayer on nickel and platinum ohmic contacts for n-type SiC (en)
skos:notation
  • RIV/60461373:22310/09:00021587!RIV10-MSM-22310___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM6046137302)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 312440
http://linked.open...ai/riv/idVysledku
  • RIV/60461373:22310/09:00021587
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • SiC; Silicon; Platinum; Nickel; Silicide (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [67A45C82C25C]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
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  • Proceedings ISSE 2009 32nd International Spring Seminar on Electronics Technology
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Barda, Bohumil
  • Machač, Petr
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
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  • Vysoké učení technické v Brně
https://schema.org/isbn
  • 978-1-4244-4260-7
http://localhost/t...ganizacniJednotka
  • 22310
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