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Description
  • This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.
  • This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail. (en)
Title
  • Thick Printed Copper Conductors on Alumina substrates
  • Thick Printed Copper Conductors on Alumina substrates (en)
skos:prefLabel
  • Thick Printed Copper Conductors on Alumina substrates
  • Thick Printed Copper Conductors on Alumina substrates (en)
skos:notation
  • RIV/49777513:23220/14:43922441!RIV15-MSM-23220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(ED2.1.00/03.0094), P(LF14029)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 50426
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23220/14:43922441
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • thick films; thermal conductivity; copper; alumina (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [DF112E3CAD45]
http://linked.open...v/mistoKonaniAkce
  • Drážďany, Německo
http://linked.open...i/riv/mistoVydani
  • Piscataway
http://linked.open...i/riv/nazevZdroje
  • Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (ISSE 2014)
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Řeboun, Jan
  • Štulík, Jiří
  • Hromadka, Karel
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
issn
  • 2161-2528
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2014.6887570
http://purl.org/ne...btex#hasPublisher
  • IEEE
https://schema.org/isbn
  • 978-1-4799-4455-2
http://localhost/t...ganizacniJednotka
  • 23220
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