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Description
  • This paper deals with a method for low cost power electronic substrates creation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. In this work, the muffle furnace is used for bonding copper to ceramic. Temperature profile, oxygen concentration during the bonding process and final treatment is described. The last part summarizes the results and presents advantages of this method.
  • This paper deals with a method for low cost power electronic substrates creation, which are used for power electronic devices. Direct bond copper (DBC) technology is suitable for creating substrates with excellent thermal and electrical conductivity and good mechanical properties. Furthermore, DBC allows to create copper layers with the thickness of hundreds micrometers in one processing step. In this work, the muffle furnace is used for bonding copper to ceramic. Temperature profile, oxygen concentration during the bonding process and final treatment is described. The last part summarizes the results and presents advantages of this method. (en)
Title
  • DBC Technology for low cost power electronic substrate manufacturing
  • DBC Technology for low cost power electronic substrate manufacturing (en)
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  • DBC Technology for low cost power electronic substrate manufacturing
  • DBC Technology for low cost power electronic substrate manufacturing (en)
skos:notation
  • RIV/49777513:23220/14:43922435!RIV15-MSM-23220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • I, P(ED2.1.00/03.0094)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 9866
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23220/14:43922435
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • DBC; thick film copper; alumina; Ceramic substrate (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [6B0B1793723D]
http://linked.open...v/mistoKonaniAkce
  • Zadar, Chorvatsko
http://linked.open...i/riv/mistoVydani
  • Vienna
http://linked.open...i/riv/nazevZdroje
  • Procedia Engineering
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Hamáček, Aleš
  • Řeboun, Jan
  • Štulík, Jiří
  • Hromadka, Karel
http://linked.open...vavai/riv/typAkce
http://linked.open...ain/vavai/riv/wos
  • 000335859300156
http://linked.open.../riv/zahajeniAkce
issn
  • 1877-7058
number of pages
http://bibframe.org/vocab/doi
  • 10.1016/j.proeng.2014.03.107
http://purl.org/ne...btex#hasPublisher
  • Elsevier
http://localhost/t...ganizacniJednotka
  • 23220
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