About: Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu

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About: Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu Goto Sponge NotDistinct Permalink

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering. The paper describes the effect of the solder profile on the formation of an intermetallic layer in the solder composition of 57.6% Bi-42% Sn-0.4% Ag. Soldered joints were made by soldering of chip resistors of 1206 size with different soldering reflow profiles. Solder pads on the PCB are made of copper therefore they mainly make Cu6Sn5 IMC. This layer has an effect on the mechanical strength of the soldered joint. Samples are measured by using the shear strength test. The thickness of the IMC layer is measured by Confocal Laser Scanning Microscope. IMC layer thickness grows with greater delivered energy into the joint during soldering. (en)
Title	Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu (en)
skos:prefLabel	Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu Influence of Reflow Soldering Profiles on Creation of IMC at the Interface of SnBi/Cu (en)
skos:notation	RIV/49777513:23220/14:43922117!RIV15-MSM-23220___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2015
http://linked.open...aciTvurceVysledku	Hirman, Martin Rendl, Karel Wirth, Václav Steiner, František
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Západočeská univerzita v Plzni / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	21576
http://linked.open...ai/riv/idVysledku	RIV/49777513:23220/14:43922117
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	SnBi/Cu; Interface; the; IMC; Creation; Profiles; Soldering; Reflow; Influence (en)
http://linked.open.../riv/klicoveSlovo	IMC Influence Interface Creation Profiles Reflow SnBi/Cu the Soldering
http://linked.open...ontrolniKodProRIV	[EB3EDB24F87B]
http://linked.open...v/mistoKonaniAkce	Drážďany
http://linked.open...i/riv/mistoVydani	Templin
http://linked.open...i/riv/nazevZdroje	ISSE 2014 - 37th International Spring Seminar on Electronics Technology - %22Advances in Electronic System Integration%22
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...UplatneniVysledku	2014
http://linked.open...iv/tvurceVysledku	Rendl, Karel Steiner, František Wirth, Václav Hirman, Martin
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2014-05-07 (xsd:date)
issn	2161-2528
number of pages	5 (xsd:int)
http://bibframe.org/vocab/doi	10.1109/ISSE.2014.6887582
http://purl.org/ne...btex#hasPublisher	Verlag Dr. Markus A. Detert
https://schema.org/isbn	978-1-4799-4455-2
http://localhost/t...ganizacniJednotka	23220

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