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  • This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made for experiment. The soldered joints were created on the test samples by hand soldering proces at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test samples were divided into several groups. These groups differ in two parameters. The first parameter is soldering process. Half of the samples were soldered for a period of 10 s and the second half of samples were soldered for a period of 60 s. The second parameter is thermal stress. The test samples were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The samples were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes will be presented in this article.
  • This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made for experiment. The soldered joints were created on the test samples by hand soldering proces at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test samples were divided into several groups. These groups differ in two parameters. The first parameter is soldering process. Half of the samples were soldered for a period of 10 s and the second half of samples were soldered for a period of 60 s. The second parameter is thermal stress. The test samples were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The samples were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes will be presented in this article. (en)
Title
  • Long-term Behavior of IMCs in Lead-free Solder Joints
  • Long-term Behavior of IMCs in Lead-free Solder Joints (en)
skos:prefLabel
  • Long-term Behavior of IMCs in Lead-free Solder Joints
  • Long-term Behavior of IMCs in Lead-free Solder Joints (en)
skos:notation
  • RIV/49777513:23220/11:43898554!RIV15-MSM-23220___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • S, Z(MSM4977751310)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 209922
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23220/11:43898554
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • soldering; thermal stress; lead-free solder joint; Intermetallic compound (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [C140D8ADB8B9]
http://linked.open...v/mistoKonaniAkce
  • Tatranská Lomnice
http://linked.open...i/riv/mistoVydani
  • Košice
http://linked.open...i/riv/nazevZdroje
  • ISSE 2011
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Hujer, Tomáš
  • Novák, Tomáš
  • Steiner, František
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
issn
  • 2161-2528
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ISSE.2011.6053573
http://purl.org/ne...btex#hasPublisher
  • Technical Universita of Košice
https://schema.org/isbn
  • 978-1-4577-2112-0
http://localhost/t...ganizacniJednotka
  • 23220
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