About: Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC

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About: Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Goto Sponge NotDistinct Permalink

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere an (en)
Title	Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC (en)
skos:prefLabel	Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC (en)
skos:notation	RIV/49777513:23220/10:00504874!RIV11-MSM-23220___
http://linked.open...avai/riv/aktivita	S Z
http://linked.open...avai/riv/aktivity	S, Z(MSM4977751310)
http://linked.open...iv/cisloPeriodika	3
http://linked.open...vai/riv/dodaniDat	2011
http://linked.open...aciTvurceVysledku	Novák, Tomáš Steiner, František
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Západočeská univerzita v Plzni / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	256220
http://linked.open...ai/riv/idVysledku	RIV/49777513:23220/10:00504874
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Intermetallic compounds; lead-free solder; copper substrate; thermal aging (en)
http://linked.open.../riv/klicoveSlovo	thermal aging lead-free solder Intermetallic compounds copper substrate
http://linked.open...odStatuVydavatele	CZ - Česká republika
http://linked.open...ontrolniKodProRIV	[9EF710C3F423]
http://linked.open...i/riv/nazevZdroje	Electroscope
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2010
http://linked.open...v/svazekPeriodika	2010
http://linked.open...iv/tvurceVysledku	Novák, Tomáš Steiner, František
http://linked.open...n/vavai/riv/zamer	Diagnostic of interactive processes in electrical engineering
issn	1802-4564
number of pages	5 (xsd:int)
http://localhost/t...ganizacniJednotka	23220
is http://linked.open...avai/riv/vysledek of	Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC Effect of Thermal Stress and Constitution of Lead-Free Soldering Alloys on Creation and Growth of IMC

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