About: Improvement of plating adhesion on PhotoVia substrates     Goto   Sponge   NotDistinct   Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

AttributesValues
rdf:type
Description
  • Tento příspěvek se zabývá mikrovia substráty. Mikrovia substráty jsou speciální vícevrsrvé plošné spoje s vysokou hustotou propojů a průměrem otvorů pod 150um. K výrobě mikrovia substrátů byla npoužita fotolitografická metoda - FotoVia. Příspěvek se zabývá speciálním fotokompozitním dielektrickým materiálem, který na rozdíl od běžných materiálů nevyžaduje žádnou další úpravu povrchu pro zvýšení adheze. Na vzorcích z tohoto materiálu byla měřena drsnost a adheze k dalším vrstvám. (cs)
  • This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter of interconnection vias. PhotoVia method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness of dielectric surface and adhesion of conductive layer were measured.
  • This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter of interconnection vias. PhotoVia method was used for the creation of microvias by photolithography. For this method, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness of dielectric surface and adhesion of conductive layer were measured. (en)
Title
  • Improvement of plating adhesion on PhotoVia substrates
  • Zvýšení adheze na FotoVia substrátech (cs)
  • Improvement of plating adhesion on PhotoVia substrates (en)
skos:prefLabel
  • Improvement of plating adhesion on PhotoVia substrates
  • Zvýšení adheze na FotoVia substrátech (cs)
  • Improvement of plating adhesion on PhotoVia substrates (en)
skos:notation
  • RIV/49777513:23220/07:00000113!RIV08-MSM-23220___
http://linked.open.../vavai/riv/strany
  • 203-207
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM4977751310)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 425782
http://linked.open...ai/riv/idVysledku
  • RIV/49777513:23220/07:00000113
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • PhotoVia; Microvia; ceramic filler; BaTiO3; TiO2; adhesion; roughness (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [613BA39640EA]
http://linked.open...v/mistoKonaniAkce
  • Cluj-Napoca
http://linked.open...i/riv/mistoVydani
  • Cluj-Napoca
http://linked.open...i/riv/nazevZdroje
  • ISSE 2007
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Hamáček, Aleš
  • Řeboun, Jan
  • Kidora, Jan
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Technical University
https://schema.org/isbn
  • 1-4244-1218-8
http://localhost/t...ganizacniJednotka
  • 23220
is http://linked.open...avai/riv/vysledek of
Faceted Search & Find service v1.16.118 as of Jun 21 2024


Alternative Linked Data Documents: ODE     Content Formats:   [cxml] [csv]     RDF   [text] [turtle] [ld+json] [rdf+json] [rdf+xml]     ODATA   [atom+xml] [odata+json]     Microdata   [microdata+json] [html]    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3240 as of Jun 21 2024, on Linux (x86_64-pc-linux-gnu), Single-Server Edition (126 GB total memory, 58 GB memory in use)
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2024 OpenLink Software