About: EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper. Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper. (en)
Title	EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS (en)
skos:prefLabel	EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS (en)
skos:notation	RIV/00216305:26220/12:PU101080!RIV13-MSM-26220___
http://linked.open...avai/predkladatel	Fakulta elektrotechniky a komunikačních technologií
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Adámek, Martin Schnederle, Petr
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	133171
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU101080
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Nitrogen, atmosphere, alumina, lead-free solder (en)
http://linked.open.../riv/klicoveSlovo	Nitrogen lead-free solder atmosphere alumina
http://linked.open...ontrolniKodProRIV	[652EBFF3FF02]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Adámek, Martin Schnederle, Petr
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-06-28 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno
https://schema.org/isbn	978-80-214-4539-0
http://localhost/t...ganizacniJednotka	26220
is http://linked.open...avai/riv/vysledek of	EFFECT OF NITROGEN ATMOSPHERE ON THE QUALITY OF LEAD-FREE SOLDER JOINTS

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