About: Thick Film 3-D Electrode Configuration for Electrochemical Applications

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.estc2012.eu
Description	Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper. Miniature electrochemical sensors can be economically produced by thick-film technology. An area of working electrode and an electrode topology design is the important parts of design optimization of electrode system. The design of standard thick-film electrode construction is limited (2-D construction, substrate dimensions, resolution, paste parameters ...). Therefore rules for classical electrode systems cannot be used fully in this case and larger electrode area can be making by 3 D structure only. One of resolutions is unconventional method. The increase of electrode surface by unconventional method – ball and wire bonding is discussed in this paper. (en)
Title	Thick Film 3-D Electrode Configuration for Electrochemical Applications Thick Film 3-D Electrode Configuration for Electrochemical Applications (en)
skos:prefLabel	Thick Film 3-D Electrode Configuration for Electrochemical Applications Thick Film 3-D Electrode Configuration for Electrochemical Applications (en)
skos:notation	RIV/00216305:26220/12:PU101025!RIV13-MPO-26220___
http://linked.open...avai/predkladatel	Fakulta elektrotechniky a komunikačních technologií
http://linked.open...avai/riv/aktivita	P S
http://linked.open...avai/riv/aktivity	P(2A-1TP1/143), S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Štekovič, Michal Adámek, Martin
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	174341
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU101025
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Thick-Film sensor, 3-D structure, ball and wire bonding (en)
http://linked.open.../riv/klicoveSlovo	3-D structure Thick-Film sensor ball and wire bonding
http://linked.open...ontrolniKodProRIV	[C4671FA8B291]
http://linked.open...v/mistoKonaniAkce	Amsterdam RAI
http://linked.open...i/riv/mistoVydani	Amsterdam
http://linked.open...i/riv/nazevZdroje	4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	3 (xsd:int)
http://linked.open...cetTvurcuVysledku	3 (xsd:int)
http://linked.open...vavai/riv/projekt	Research of novel mechatronic MEMS structures for pressure measurements
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Adámek, Martin Štekovič, Michal
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-09-17 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium
https://schema.org/isbn	978-1-4673-4644-3
http://localhost/t...ganizacniJednotka	26220
is http://linked.open...avai/riv/vysledek of	Thick Film 3-D Electrode Configuration for Electrochemical Applications

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