About: The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.estc2012.eu
Description	Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength. Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength. (en)
Title	The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates (en)
skos:prefLabel	The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates (en)
skos:notation	RIV/00216305:26220/12:PU101021!RIV13-MPO-26220___
http://linked.open...avai/predkladatel	Fakulta elektrotechniky a komunikačních technologií
http://linked.open...avai/riv/aktivita	P S
http://linked.open...avai/riv/aktivity	P(2A-1TP1/143), S
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Szendiuch, Ivan Adámek, Martin Schnederle, Petr Lipavský, Lubomír
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	162868
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/12:PU101021
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Solder joints, ceramic, wetting angle, shear test. (en)
http://linked.open.../riv/klicoveSlovo	Solder joints shear test. wetting angle ceramic
http://linked.open...ontrolniKodProRIV	[2ADCAA0EEC31]
http://linked.open...v/mistoKonaniAkce	Amsterdam RAI
http://linked.open...i/riv/mistoVydani	Amsterdam, NL
http://linked.open...i/riv/nazevZdroje	4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	4 (xsd:int)
http://linked.open...cetTvurcuVysledku	4 (xsd:int)
http://linked.open...vavai/riv/projekt	Research of novel mechatronic MEMS structures for pressure measurements
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Adámek, Martin Schnederle, Petr Lipavský, Lubomír
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-09-17 (xsd:date)
number of pages	5 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium
https://schema.org/isbn	978-1-4673-4644-3
http://localhost/t...ganizacniJednotka	26220
is http://linked.open...avai/riv/vysledek of	The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

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