About: Modeling of Microelectronic Structures and Packages using ANSYS Software

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components. This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components. (en)
Title	Modeling of Microelectronic Structures and Packages using ANSYS Software Modeling of Microelectronic Structures and Packages using ANSYS Software (en)
skos:prefLabel	Modeling of Microelectronic Structures and Packages using ANSYS Software Modeling of Microelectronic Structures and Packages using ANSYS Software (en)
skos:notation	RIV/00216305:26220/11:PU93346!RIV12-MSM-26220___
http://linked.open...avai/predkladatel	Fakulta elektrotechniky a komunikačních technologií
http://linked.open...avai/riv/aktivita	S Z
http://linked.open...avai/riv/aktivity	S, Z(MSM0021630503)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Psota, Boleslav
http://linked.open.../riv/druhVysledku	O - Ostatní výsledky nezařaditelné do žádného z výše uvedených druhů výsledku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	213001
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/11:PU93346
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Mechanical stress, ANSYS, BGA, Simulation (en)
http://linked.open.../riv/klicoveSlovo	BGA Mechanical stress Simulation ANSYS
http://linked.open...ontrolniKodProRIV	[124265CC6234]
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Szendiuch, Ivan Psota, Boleslav
http://linked.open...n/vavai/riv/zamer	Nové trendy v mikroelektronických systémech a nanotechnologiích (MIKROSYN)
http://localhost/t...ganizacniJednotka	26220

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