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  • Bezolovnatý pájecí proces nahradí stávající v průběhu roku 2006. Je to dáno ekologickými normami. Proces bezolovnatého pájení vyžaduje znalosti o materiálové i procesní kompatibilitě. Volba materiálu je důležitá pro formování pájeného spoje i pro jeho spolehlivost. (cs)
  • Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder jooint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis o
  • Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE – Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder jooint reliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces – melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process – wetting phenomena especially wetting angle and wetting angle hysteresis o (en)
Title
  • Bezolovnaté pájení a smáčení povrchu substrátu pájkou (cs)
  • Solder Wetting of Substrate Surface in Lead Free Soldering
  • Solder Wetting of Substrate Surface in Lead Free Soldering (en)
skos:prefLabel
  • Bezolovnaté pájení a smáčení povrchu substrátu pájkou (cs)
  • Solder Wetting of Substrate Surface in Lead Free Soldering
  • Solder Wetting of Substrate Surface in Lead Free Soldering (en)
skos:notation
  • RIV/00216305:26220/04:PU45759!RIV/2005/MSM/262205/N
http://linked.open.../vavai/riv/strany
  • 394-398
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 586908
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/04:PU45759
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • lead free, wetting, surface finish, substrate, flux (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [C850D1BB3867]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
http://linked.open...i/riv/nazevZdroje
  • The 11th Electronic Devices and Systems Conference
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Starý, Jiří
  • Kazelle, Jiří
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Vysoké učení technické v Brně
https://schema.org/isbn
  • 80-214-2701-9
http://localhost/t...ganizacniJednotka
  • 26220
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