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Description
  • Vlivem teplotních gradientů a mechanických tlaků během procesu výroby integrovaného obvodu je křemíkový čip namáhán. Popisovaný měricí systém umožňuje do hloubky studovat mechanismy a následky tohoto namáhání. Umožní také výzkum v oblasti nových metod pouzdření a zapojení polovodičových čipů. (cs)
  • Due to thermal and mechanical loading during manufacturing of integrated curcuits, stress is produced on the silicon chip. The equipment described allows in depth study of the stress and is used during developementof new methodologies of packaging.
  • Due to thermal and mechanical loading during manufacturing of integrated curcuits, stress is produced on the silicon chip. The equipment described allows in depth study of the stress and is used during developementof new methodologies of packaging. (en)
Title
  • Návrh testovacího prostředí pro měření mechanického napěti na čipu integrovaných obvodů (cs)
  • Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits
  • Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits (en)
skos:prefLabel
  • Návrh testovacího prostředí pro měření mechanického napěti na čipu integrovaných obvodů (cs)
  • Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits
  • Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits (en)
skos:notation
  • RIV/00216305:26220/03:PU48625!RIV/2005/GA0/262205/N
http://linked.open.../vavai/riv/strany
  • 1-5
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • P(GA102/00/0939)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 603438
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/03:PU48625
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • mechanical stress, reliability, packages, intergated ciruits (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [3F756F3A4A49]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
http://linked.open...i/riv/nazevZdroje
  • Proceedings of the 10th Electronic Devices and Systems Conference EDS 2003
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Bartoň, Zdeněk
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
number of pages
http://purl.org/ne...btex#hasPublisher
  • Neuveden
https://schema.org/isbn
  • 80-214-2452-4
http://localhost/t...ganizacniJednotka
  • 26220
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