About: Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere     Goto   Sponge   NotDistinct   Permalink

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  • Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settingss. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE - Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process - wetting phenomena
  • Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settingss. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE - Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process - wetting phenomena (en)
Title
  • Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere
  • Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere (en)
skos:prefLabel
  • Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere
  • Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere (en)
skos:notation
  • RIV/00216305:26220/03:PU39078!RIV/2004/MSM/262204/N
http://linked.open.../vavai/riv/strany
  • 438-441
http://linked.open...avai/riv/aktivita
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  • Z(MSM 262200022)
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  • 635487
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  • RIV/00216305:26220/03:PU39078
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  • lead free, solderability. wettability, surface finish, flux, nitrogen, forming gas (en)
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  • [BF89B791DAAB]
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  • Brno
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  • Brno
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  • Electronic Devices and Systems EDS 03
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  • Starý, Jiří
  • Kazelle, Jiří
http://linked.open...vavai/riv/typAkce
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http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Vysoké učení technické v Brně
https://schema.org/isbn
  • 80-214-2452-4
http://localhost/t...ganizacniJednotka
  • 26220
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