About: Modelling of 3D Multisubstrate Structures

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd. This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd. (en)
Title	Modelling of 3D Multisubstrate Structures Modelling of 3D Multisubstrate Structures (en)
skos:prefLabel	Modelling of 3D Multisubstrate Structures Modelling of 3D Multisubstrate Structures (en)
skos:notation	RIV/00216305:26220/03:PU38468!RIV/2004/MSM/262204/N
http://linked.open.../vavai/riv/strany	1-1
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM 262200022)
http://linked.open...iv/cisloPeriodika	4/11
http://linked.open...vai/riv/dodaniDat	2004
http://linked.open...aciTvurceVysledku	Bulva, Jindřich
http://linked.open.../riv/druhVysledku	J - Článek v odborném periodiku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	Vysoké učení technické v Brně / Fakulta elektrotechniky a komunikačních technologií
http://linked.open...dnocenehoVysledku	615952
http://linked.open...ai/riv/idVysledku	RIV/00216305:26220/03:PU38468
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	ANSYS, MSM, modelling, thermomechanical properties (en)
http://linked.open.../riv/klicoveSlovo	modelling thermomechanical properties ANSYS MSM
http://linked.open...odStatuVydavatele	CZ - Česká republika
http://linked.open...ontrolniKodProRIV	[1431278029B5]
http://linked.open...i/riv/nazevZdroje	ElectronicsLetters.com - http://www.electronicsletters.com
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	1 (xsd:int)
http://linked.open...ocetUcastnikuAkce	0 (xsd:int)
http://linked.open...nichUcastnikuAkce	0 (xsd:int)
http://linked.open...UplatneniVysledku	2003
http://linked.open...v/svazekPeriodika	2003
http://linked.open...iv/tvurceVysledku	Bulva, Jindřich
http://linked.open...n/vavai/riv/zamer	http://linked.opendata.cz/resource/domain/vavai/zamer/MSM%20262200022
issn	1213-161X
number of pages	1 (xsd:int)
http://localhost/t...ganizacniJednotka	26220

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