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  • This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd.
  • This paper is focused on thermomechanical modelling of two substrates with different CTE, which can be used in various types of MSM. There can be used two materials, laminate FR4 and ceramic 96%Al2O3. The interconnection of substrates is done by solder joints, where lead free solder SnAgCu is investigated in this work. ANSYS software is used and results from several analyses are discussed. One of the main purposes is a comparison of thermomechanical properties of MSMs when solder bumps height is changedd. (en)
Title
  • Influence of Bump Height to Multisubstrate Structures Construction
  • Influence of Bump Height to Multisubstrate Structures Construction (en)
skos:prefLabel
  • Influence of Bump Height to Multisubstrate Structures Construction
  • Influence of Bump Height to Multisubstrate Structures Construction (en)
skos:notation
  • RIV/00216305:26220/03:PU37824!RIV/2004/MSM/262204/N
http://linked.open.../vavai/riv/strany
  • 377-381
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 610228
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/03:PU37824
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • ANSYS, MSM, modelling, thermomechanical properties (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [4F1B0F346C7F]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
http://linked.open...i/riv/nazevZdroje
  • Proceedings of 10-th Electronic Devices and Systems Conference 2003
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...ocetUcastnikuAkce
http://linked.open...nichUcastnikuAkce
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Szendiuch, Ivan
  • Bulva, Jindřich
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Ing. Zdeněk Novotný CSc.
https://schema.org/isbn
  • 80-214-2452-4
http://localhost/t...ganizacniJednotka
  • 26220
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