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  • As today’s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from severall ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates.
  • As today’s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from severall ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates. (en)
Title
  • Thermomechanical Modelling of Multisubstrate Modules
  • Thermomechanical Modelling of Multisubstrate Modules (en)
skos:prefLabel
  • Thermomechanical Modelling of Multisubstrate Modules
  • Thermomechanical Modelling of Multisubstrate Modules (en)
skos:notation
  • RIV/00216305:26220/02:PU29151!RIV/2003/MSM/262203/N
http://linked.open.../vavai/riv/strany
  • 230-233
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM 262200022)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 666950
http://linked.open...ai/riv/idVysledku
  • RIV/00216305:26220/02:PU29151
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • ANSYS modelling, MSM, thermomechanical properties (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [84833EE85075]
http://linked.open...v/mistoKonaniAkce
  • Brno
http://linked.open...i/riv/mistoVydani
  • Brno
http://linked.open...i/riv/nazevZdroje
  • Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...nichUcastnikuAkce
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Bílek, Jaromír
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
number of pages
http://purl.org/ne...btex#hasPublisher
  • Ing. Zdeněk Novotný CSc.
https://schema.org/isbn
  • 80-214-2180-0
http://localhost/t...ganizacniJednotka
  • 26220
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