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  • Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
  • Sintering effect of Ag nanoparticles studied in this work seems to be an interesting alternative of lead-free soldering. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. (en)
Title
  • Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
  • Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere (en)
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  • Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere
  • Interaction of Silver Nanoparticles with Copper Substrate under Air Atmosphere (en)
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  • RIV/00216224:14310/10:00049625!RIV12-GA0-14310___
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  • P(GA106/09/0700), S
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  • 264399
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  • RIV/00216224:14310/10:00049625
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  • Soldering nanopowder substrate characterisation (en)
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  • [37EBBAB216A0]
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  • Anaheim (CA)
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  • Danville, CA 94526, U.S.A.
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  • TechConnect WORLD Conference & Expo 2010
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  • Buršík, Jiří
  • Buršíková, Vilma
  • Brož, Pavel
  • Sopoušek, Jiří
  • Zálešák, Jakub
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  • Nano Science and Technology Institute
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  • 978-1-4398-3421-3
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  • 14310
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