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  • Theoretical and experimental study of phase equilibria, physical, chemical, mechanical and utility properties of perspective solder materials for high-temperature applications. Our attention will be focused on Bi-Ag, Sb-Sn, Zn-Sn, Zn-Al binary alloys and similar types and their modifications by a third element, e.g. Mg, Ni, Cu, Sn, Bi. Curves and surfaces of solidus and liquidus will be modelled in order to determine segregation coefficients of individual components in these systems at equilibrium and non-equilibrium crystallization. The alloys prepared experimentally will be analysed with a view to establish phase equilibria. Reactive diffusion will be utilized for this purpose in order to determine the corresponding interaction parameters. (en)
  • Teoretické a experimentální studium fázových rovnováh, fyzikálních, chemických, mechanických a užitných vlastností materiálů pájek na bázi Bi-Ag, Sb-Sn, Zn-Sn, Zn-Al pro vysokoteplotní aplikace a jejich modifikací dalšími prvky např. Mg, Ni, Cu, Sn, Bi.
Title
  • Theoretical and experimental study of phase equilibria in solder materials for high-temperature applications (en)
  • Teoretické a experimentální studium fázových rovnováh materiálů pájek pro vysokoteplotní aplikace
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  • OC08032
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  • High-temperature soldering; Pb-free solder alloys; multiscale modelling; materials properties; reliability. (en)
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  • Projekt materiálového výzkumu s názvem „Teoretické a experimentální studium fázových rovnovah materiálů pájek pro vysokoteplotní aplikace“ byl řešen v souladu s cíli programu COST Action MP0602 „Advanced Solder Materials for High-Temperature Application“. Týkal se ternárního systému Al-Sn-Zn, nových typů alternativních bezolovnatých pájek a reaktivní difuze při kontaktu mědi s taveninou pájky. (cs)
  • The project of material research „Theoretical and experimental study of phase equilibria of solder materials for high temperature applications“ was solved in accordance with the COST Action MP0602 „Advanced Solder Materials for High-Temperature Application“. It concerned about the Al-Sn-Zn ternary system, new types of lead-free solders and reactive diffusion at the contact of Cu with solder melt. (en)
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  • Pb-free solder alloys
  • materials properties
  • multiscale modelling
  • High-temperature soldering
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