About: The Packaging of futuRe Integrated ModulAr Electronics     Goto   Sponge   NotDistinct   Permalink

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  • The packaging of future Integrated Modular electronics objective is to develop a new flexible, robust and open commercial aeronautical packaging of embedded electronics for future aircraft. This new standard will be able to replace the 35 year old ARINC 600 standard, integrating the new archtecture concepts and technologies trends. The project is an enabling key building block for the next generation of electronics and particulary to Integrated Modular Avionics for future large and regional aircraft. Project objectives are: 1. reduce electronics packaging in terms of volume (50%) and weight(30%) and offer flexibility and growth capability 2. reduce costs (20%)using market standard components 3. enhance reliability (50%)through thermal and vibration improvement 4. mitigate EMC protection penalties in composite fuselage environment 5. ensure fast production ramp up and support rapid final assembly on Aircraft 6. improve availability and reduce maintenance cost 7. using of composite materials for packaging (en)
  • The packaging of future Integrated Modular electronics objective is to develop a new flexible, robust and open commercial aeronautical packaging of embedded electronics for future aircraft. This new standard will be able to replace the 35 year old ARINC 600 standard, integrating the new archtecture concepts and technologies trends. The project is an enabling key building block for the next generation of electronics and particulary to Integrated Modular Avionics for future large and regional aircraft. Project objectives are: 1. reduce electronics packaging in terms of volume (50%) and weight(30%) and offer flexibility and growth capability 2. reduce costs (20%)using market standard components 3. enhance reliability (50%)through thermal and vibration improvement 4. mitigate EMC protection penalties in composite fuselage environment 5. ensure fast production ramp up and support rapid final assembly on Aircraft 6. improve availability and reduce maintenance cost 7. using of composite materials for packaging (cs)
Title
  • The Packaging of futuRe Integrated ModulAr Electronics (en)
  • The Packaging of futuRe Integrated ModulAr Electronics (cs)
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  • Packaging; Cooling; Avionics; Modular Integrated Packaging; Key Building (en)
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