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Description
| - In this paper we are dealing with the possibility of electronic waste separation by temperature effect. It gives a possible direction how to solve the problem of increasing with electronic waste not only in Czech Republic, but also throughout the world. Further, we are dealing with of heat transfer inside the printed circuit boards (PCB) because particular layers generally have each different values of mechanical characteristics, especially of Young modulus and thermal expansivity. In case of thermal change, the layers prevent each other from rising of their own thermal dilatations which correspond to the temperature change. For describing temperature and stress fields we used FEM modeling, which offer the view of the whole structure of used materials and subsequently their movement in dependence on the changes of the ambient temperature. (en)
- In this paper we are dealing with the possibility of electronic waste separation by temperature effect. It gives a possible direction how to solve the problem of increasing with electronic waste not only in Czech Republic, but also throughout the world. Further, we are dealing with of heat transfer inside the printed circuit boards (PCB) because particular layers generally have each different values of mechanical characteristics, especially of Young modulus and thermal expansivity. In case of thermal change, the layers prevent each other from rising of their own thermal dilatations which correspond to the temperature change. For describing temperature and stress fields we used FEM modeling, which offer the view of the whole structure of used materials and subsequently their movement in dependence on the changes of the ambient temperature.
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Title
| - TREATMENT OF ELECTRONIC WASTE
- TREATMENT OF ELECTRONIC WASTE (en)
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skos:prefLabel
| - TREATMENT OF ELECTRONIC WASTE
- TREATMENT OF ELECTRONIC WASTE (en)
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skos:notation
| - RIV/70883521:28140/09:63507802!RIV10-MSM-28140___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/70883521:28140/09:63507802
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - Electronic waste; printed circuit boards (PCBs); recycling; temperature field; transient thermal stress. (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 10th International Carpathian Control Conference
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Charvátová, Hana
- Janáčová, Dagmar
- Kolomazník, Karel
- Vašek, Vladimír
- Šuba, Oldřich
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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http://linked.open...n/vavai/riv/zamer
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number of pages
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http://purl.org/ne...btex#hasPublisher
| - Faculty of Mechanical Engineering and Robotics
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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