About: Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip

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About: Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip Goto Sponge NotDistinct Permalink

An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	3D silicon sensors with electrodes penetrating the full substrate thickness, different electrode configurations and with active edges, where bump-bonded to the ATLAS pixel readout chip FE-I3 in 2006. Their characterization included electrical tests in laboratory, tests with beam and radioactive sources. Noise figures after bump bonding varied from 190 to 290 electrons, in agreement with the different electrode density of the three 3D configurations. This paper will reports beam results on the edge sensitivity, electrode response and efficiency at different angles of 3D sensors, fabricated at Stanford and bump-bonded to the ATLAS FE-I3 front end chip, before and after irradiation to 1015 high energy protons per cm2. 3D silicon sensors with electrodes penetrating the full substrate thickness, different electrode configurations and with active edges, where bump-bonded to the ATLAS pixel readout chip FE-I3 in 2006. Their characterization included electrical tests in laboratory, tests with beam and radioactive sources. Noise figures after bump bonding varied from 190 to 290 electrons, in agreement with the different electrode density of the three 3D configurations. This paper will reports beam results on the edge sensitivity, electrode response and efficiency at different angles of 3D sensors, fabricated at Stanford and bump-bonded to the ATLAS FE-I3 front end chip, before and after irradiation to 1015 high energy protons per cm2. (en) Clanek pojednava o charakterizaci hran 3D kremikoveho detektoru po Bump-Bondingu s ATLAS Pixel Readout Chipem (cs)
Title	Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip Charakterizace hran 3D kremikoveho detektoru po Bump-Bondingu s ATLAS Pixel Readout Chipem (cs) Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip (en)
skos:prefLabel	Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip Charakterizace hran 3D kremikoveho detektoru po Bump-Bondingu s ATLAS Pixel Readout Chipem (cs) Edge Characterization of 3D Silicon Sensors after Bump-Bonding with the ATLAS Pixel Readout Chip (en)
skos:notation	RIV/68407700:21670/08:15152671!RIV09-MSM-21670___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM6840770029)
http://linked.open...vai/riv/dodaniDat	2009
http://linked.open...aciTvurceVysledku	Slavíček, Tomáš Linhart, Vladimír
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Ústav technické a experimentální fyziky ČVUT
http://linked.open...dnocenehoVysledku	364871
http://linked.open...ai/riv/idVysledku	RIV/68407700:21670/08:15152671
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	3D silicon sensor; ATLAS; PIXEL (en)
http://linked.open.../riv/klicoveSlovo	ATLAS PIXEL 3D silicon sensor
http://linked.open...ontrolniKodProRIV	[16381E3936BB]
http://linked.open...v/mistoKonaniAkce	Dresden
http://linked.open...i/riv/mistoVydani	Wisconsin
http://linked.open...i/riv/nazevZdroje	Conference Record of the 2008 IEEE NSS/MIC/RTSD
http://linked.open...in/vavai/riv/obor	BG
http://linked.open...ichTvurcuVysledku	2 (xsd:int)
http://linked.open...cetTvurcuVysledku	13 (xsd:int)
http://linked.open...UplatneniVysledku	2008
http://linked.open...iv/tvurceVysledku	Slavíček, Tomáš Linhart, Vladimír Bolle, E. Chatterji, S. Da Via, C. Gjersdal, H. Hasi, J. Rohne, O.
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2008-10-19 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Fundamental Experiments in Physics of Microworld
issn	1082-3654
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Omipress
https://schema.org/isbn	978-1-4244-2715-4
http://localhost/t...ganizacniJednotka	21670

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