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  • The goal of this work was to find if the numer of components in one- and two-component conductive adhesives influences their thermomechanical properties. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. It was also found that all adhesives were not optimally cured through curing was carried out in accordance with recomendation of a producer of adhesives.
  • The goal of this work was to find if the numer of components in one- and two-component conductive adhesives influences their thermomechanical properties. All adhesive used in this study were of an epoxy type filled with silver flakes and all had isotropic electrical conductivity. It was also found that all adhesives were not optimally cured through curing was carried out in accordance with recomendation of a producer of adhesives. (en)
Title
  • Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives
  • Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives (en)
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  • Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives
  • Study of Thermomechanical Properties of One-and Two-Component Conductive Adhesives (en)
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  • RIV/68407700:21230/14:00219725!RIV15-MSM-21230___
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  • 48373
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  • RIV/68407700:21230/14:00219725
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  • Thermodynamic analysis; Storage moduls; Loss factor (en)
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  • [95E730D25409]
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  • Drážďany
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  • New York
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  • 37th Int. Spring Seminar on Electronics Technology
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  • Bušek, David
  • Mach, Pavel
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  • IEEE
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  • 978-1-4799-4455-2
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  • 21230
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