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  • This paper examines the effects of the time and temperature of the curing process and the effect of the pad surface material on the electrical resistance of joints formed using electrically conductive adhesives (ECA). Two types of isotropic ECA, composed of a bis-phenol epoxy matrix filled with silver flakes, were tested. The experimental data were processed in two ways, by performing full factorial experiments (FFE) of the 23 type and by using an L4 type Taguchi orthogonal array, and the results were then compared. It was found that the joint resistance is mainly affected by the curing temperature, and is less dependent on the curing time and the surface material. The interactions between these factors have been analyzed through FFE. The results showed that the Taguchi method is quite precise for the main factors, but is insufficiently accurate for processes with significant numbers of interactions.
  • This paper examines the effects of the time and temperature of the curing process and the effect of the pad surface material on the electrical resistance of joints formed using electrically conductive adhesives (ECA). Two types of isotropic ECA, composed of a bis-phenol epoxy matrix filled with silver flakes, were tested. The experimental data were processed in two ways, by performing full factorial experiments (FFE) of the 23 type and by using an L4 type Taguchi orthogonal array, and the results were then compared. It was found that the joint resistance is mainly affected by the curing temperature, and is less dependent on the curing time and the surface material. The interactions between these factors have been analyzed through FFE. The results showed that the Taguchi method is quite precise for the main factors, but is insufficiently accurate for processes with significant numbers of interactions. (en)
Title
  • Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach
  • Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach (en)
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  • Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach
  • Analysis of the Curing Process of Electrically Conductive Adhesives Using Taguchi Approach and Full Factorial Experiments Approach (en)
skos:notation
  • RIV/68407700:21230/14:00219138!RIV15-MSM-21230___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • S
http://linked.open...iv/cisloPeriodika
  • 39
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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  • 2792
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/14:00219138
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Curing; Conductive; Adhesive; Taguchi; Factorial experiments (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...odStatuVydavatele
  • DE - Spolková republika Německo
http://linked.open...ontrolniKodProRIV
  • [3B32C478EAF4]
http://linked.open...i/riv/nazevZdroje
  • Arabian Journal for Science and Engineering
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
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http://linked.open...UplatneniVysledku
http://linked.open...v/svazekPeriodika
  • 39
http://linked.open...iv/tvurceVysledku
  • Barto, Seba
  • Mach, Pavel
http://linked.open...ain/vavai/riv/wos
  • 000338199100049
issn
  • 1319-8025
number of pages
http://bibframe.org/vocab/doi
  • 10.1007/s13369-014-1167-7
http://localhost/t...ganizacniJednotka
  • 21230
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