About: Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

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rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.imaps.cz/eds/
Description	This work presents a precious thermo-mechanical simulation and characterization of designed LED board used for retrofit solid state lightening (SSL) lamp. Work focuses on a determination of a thermo-mechanical behavior during thermal cycling tests performed in a test chamber. Because of high thermal cycling range (-20...125 °C) precious creep including elastic-plastic analysis has to be done. In the first step a transient thermo-mechanical simulation of detailed LED board model was done. Critical parts of the structure from reliability point of view were found. The second part of work aims to predict the lifetime of LED board for SSL lamp exposed to thermal cycling tests done in a thermal chamber with the specified temperature profile. This work presents a precious thermo-mechanical simulation and characterization of designed LED board used for retrofit solid state lightening (SSL) lamp. Work focuses on a determination of a thermo-mechanical behavior during thermal cycling tests performed in a test chamber. Because of high thermal cycling range (-20...125 °C) precious creep including elastic-plastic analysis has to be done. In the first step a transient thermo-mechanical simulation of detailed LED board model was done. Critical parts of the structure from reliability point of view were found. The second part of work aims to predict the lifetime of LED board for SSL lamp exposed to thermal cycling tests done in a thermal chamber with the specified temperature profile. (en)
Title	Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp (en)
skos:prefLabel	Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp (en)
skos:notation	RIV/68407700:21230/13:00206298!RIV14-MSM-21230___
http://linked.open...avai/riv/aktivita	S
http://linked.open...avai/riv/aktivity	S
http://linked.open...vai/riv/dodaniDat	2014
http://linked.open...aciTvurceVysledku	Formánek, Jan
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	88937
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/13:00206298
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	SSL; LED board; thermal cycling; simulation; measurement; elastic-plastic analysis; stress; lifetime; solder; creep; Schubert model (en)
http://linked.open.../riv/klicoveSlovo	lifetime creep measurement simulation stress SSL thermal cycling LED board Schubert model elastic-plastic analysis solder
http://linked.open...ontrolniKodProRIV	[311B9C672D28]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	Proceedings - Electronic Devices and Systems - EDS '13
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2013
http://linked.open...iv/tvurceVysledku	Formánek, Jan Jakovenko, Jiří
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2013-06-26 (xsd:date)
number of pages	6 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
https://schema.org/isbn	9788021447547
http://localhost/t...ganizacniJednotka	21230

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