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Description
| - Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20 °C.
- Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20 °C. (en)
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Title
| - Simulations of High Temperature Pressure Sensor Packaging and Interconnections
- Simulations of High Temperature Pressure Sensor Packaging and Interconnections (en)
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skos:prefLabel
| - Simulations of High Temperature Pressure Sensor Packaging and Interconnections
- Simulations of High Temperature Pressure Sensor Packaging and Interconnections (en)
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skos:notation
| - RIV/68407700:21230/12:00195960!RIV13-GA0-21230___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/68407700:21230/12:00195960
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - Pressure sensor; packaging; thermal simulation (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - EuroSimE 2012 - Proceedings of the conference www.eurosime.org
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...vavai/riv/projekt
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
| - Formánek, Jan
- Jakovenko, Jiří
- Laposa, Alexandr
- Brinkfeldt, K.
- Adolfsson, E.
- Johander, P.
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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number of pages
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http://bibframe.org/vocab/doi
| - 10.1109/ESimE.2012.6191730
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http://purl.org/ne...btex#hasPublisher
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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