About: Simulations of High Temperature Pressure Sensor Packaging and Interconnections

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
rdfs:seeAlso	http://www.eurosime.org
Description	Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20 °C. Modeling and thermal cycling of a high temperature pressure sensor packaging is presented. The packaging is based on the green-state milling of alumina to the desired geometry and conduits for the electrical conductors, followed by sintering of the ceramics with the electrical conductors inside. The electrical interconnections are based on silver. For short term operation, the package can be exposed to temperatures close to the melting temperature of silver (961 °C). It has shown operational in temperature cycling above 600 °C for more than 1800 hours. Modeling of the package show that the stress in the electrical interconnections are close to the yield stress of silver at 20 °C. (en)
Title	Simulations of High Temperature Pressure Sensor Packaging and Interconnections Simulations of High Temperature Pressure Sensor Packaging and Interconnections (en)
skos:prefLabel	Simulations of High Temperature Pressure Sensor Packaging and Interconnections Simulations of High Temperature Pressure Sensor Packaging and Interconnections (en)
skos:notation	RIV/68407700:21230/12:00195960!RIV13-GA0-21230___
http://linked.open...avai/riv/aktivita	P
http://linked.open...avai/riv/aktivity	P(GA102/09/1601)
http://linked.open...vai/riv/dodaniDat	2013
http://linked.open...aciTvurceVysledku	Formánek, Jan
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	168080
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/12:00195960
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	Pressure sensor; packaging; thermal simulation (en)
http://linked.open.../riv/klicoveSlovo	packaging Pressure sensor thermal simulation
http://linked.open...ontrolniKodProRIV	[DD5B2A621276]
http://linked.open...v/mistoKonaniAkce	Lisbon
http://linked.open...i/riv/mistoVydani	Porto
http://linked.open...i/riv/nazevZdroje	EuroSimE 2012 - Proceedings of the conference www.eurosime.org
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	6 (xsd:int)
http://linked.open...vavai/riv/projekt	Intelligent micro and nano structures for microsensors realized with support of nanotechnology
http://linked.open...UplatneniVysledku	2012
http://linked.open...iv/tvurceVysledku	Formánek, Jan Jakovenko, Jiří Laposa, Alexandr Brinkfeldt, K. Adolfsson, E. Johander, P.
http://linked.open...vavai/riv/typAkce	WRD - Světová
http://linked.open.../riv/zahajeniAkce	2012-04-15 (xsd:date)
number of pages	4 (xsd:int)
http://bibframe.org/vocab/doi	10.1109/ESimE.2012.6191730
http://purl.org/ne...btex#hasPublisher	IEEE
https://schema.org/isbn	978-1-4673-1511-1
http://localhost/t...ganizacniJednotka	21230

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