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Description
  • In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster? transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board
  • In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster? transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board (en)
Title
  • Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
  • Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards (en)
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  • Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
  • Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards (en)
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  • RIV/68407700:21230/12:00195948!RIV13-MSM-21230___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • R
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 174272
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/12:00195948
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • SSL; thermal management (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [14120AC9A82E]
http://linked.open...v/mistoKonaniAkce
  • Lisbon
http://linked.open...i/riv/mistoVydani
  • Porto
http://linked.open...i/riv/nazevZdroje
  • EuroSimE 2012 - Proceedings of the conference www.eurosime.org
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Jakovenko, Jiří
  • Bancken, P.
  • Werkhoven, R.
  • Perpina, X.
  • Fargeix, A.
  • Gasse, A.
  • Pardo, B.
  • Van Weelden, T.
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
number of pages
http://bibframe.org/vocab/doi
  • 10.1109/ESimE.2012.6191750
http://purl.org/ne...btex#hasPublisher
  • IEEE
https://schema.org/isbn
  • 978-1-4673-1511-1
http://localhost/t...ganizacniJednotka
  • 21230
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