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Description
| - Reliability of conductive joints manufac-tured using electrically conductive adhesives (ECAs) de-pends mainly on their internal homogeneity. During tests of reliability of ECAs, a significant incidence of voids was observed in the joints made by one and two-component ad-hesives. The reason for the formation of voids in the ECAs joints are manufacturer recommended procedures used prior to the preparation of adhesives, processes for deposition of adhesive and the curing process of adhesive. This article presents the results of experiments aimed at research on the causes and consequences of inhomogeneity of ECA joints, and specification of procedures to minimize them. Tested samples were manufactured by one-component (AX 20) and two-component (AX 12 LVT) adhesive. Influence of date of the expiration on the two-component adhesive was also stud-ied. Voids in the joints was studied both by optical anal-ysis of thin sections and by measuring the shear strength. Test results show that the number of voids is greatest in one-component adhesive. Due to changes in viscosity during the curing process, the one-component adhesive gets under the mounting component. In extreme case this can cause even a short circuit. A similar phenomenon also occurs in two-component adhesives, though on a smaller scale.
- Reliability of conductive joints manufac-tured using electrically conductive adhesives (ECAs) de-pends mainly on their internal homogeneity. During tests of reliability of ECAs, a significant incidence of voids was observed in the joints made by one and two-component ad-hesives. The reason for the formation of voids in the ECAs joints are manufacturer recommended procedures used prior to the preparation of adhesives, processes for deposition of adhesive and the curing process of adhesive. This article presents the results of experiments aimed at research on the causes and consequences of inhomogeneity of ECA joints, and specification of procedures to minimize them. Tested samples were manufactured by one-component (AX 20) and two-component (AX 12 LVT) adhesive. Influence of date of the expiration on the two-component adhesive was also stud-ied. Voids in the joints was studied both by optical anal-ysis of thin sections and by measuring the shear strength. Test results show that the number of voids is greatest in one-component adhesive. Due to changes in viscosity during the curing process, the one-component adhesive gets under the mounting component. In extreme case this can cause even a short circuit. A similar phenomenon also occurs in two-component adhesives, though on a smaller scale. (en)
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Title
| - Voids in Joints Made of Electrically Conductive Adhesive
- Voids in Joints Made of Electrically Conductive Adhesive (en)
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skos:prefLabel
| - Voids in Joints Made of Electrically Conductive Adhesive
- Voids in Joints Made of Electrically Conductive Adhesive (en)
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skos:notation
| - RIV/68407700:21230/12:00193095!RIV13-MSM-21230___
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http://linked.open...avai/riv/aktivita
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http://linked.open...avai/riv/aktivity
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http://linked.open...vai/riv/dodaniDat
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http://linked.open...aciTvurceVysledku
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http://linked.open.../riv/druhVysledku
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http://linked.open...iv/duvernostUdaju
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http://linked.open...titaPredkladatele
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http://linked.open...dnocenehoVysledku
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http://linked.open...ai/riv/idVysledku
| - RIV/68407700:21230/12:00193095
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http://linked.open...riv/jazykVysledku
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http://linked.open.../riv/klicovaSlova
| - Voids; Electrically Conductive Adhesive; Reliability test; Shear Strength. (en)
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http://linked.open.../riv/klicoveSlovo
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http://linked.open...ontrolniKodProRIV
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http://linked.open...v/mistoKonaniAkce
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http://linked.open...i/riv/mistoVydani
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http://linked.open...i/riv/nazevZdroje
| - 16th International Student Conference on Electrical Engineering
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http://linked.open...in/vavai/riv/obor
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http://linked.open...ichTvurcuVysledku
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http://linked.open...cetTvurcuVysledku
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http://linked.open...UplatneniVysledku
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http://linked.open...iv/tvurceVysledku
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http://linked.open...vavai/riv/typAkce
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http://linked.open.../riv/zahajeniAkce
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number of pages
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http://purl.org/ne...btex#hasPublisher
| - České vysoké učení technické v Praze. Fakulta elektrotechnická
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https://schema.org/isbn
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http://localhost/t...ganizacniJednotka
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