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Description
  • Detailed analysis of 70-mil package and wafer scale package (WSP) based on the 3D field simulations is presented. It is shown that an assembly plays significant role in the package behavior. Simulation results confirm that the parameters of the package are varying with the change of the assembly-substrate parameters. The approach potentially makes possible to transfer parameters of a transistor corresponding to certain assembly to another assembly without necessity of new measurements. It is very promising in the design of amplifiers namely power amplifiers (PA).
  • Detailed analysis of 70-mil package and wafer scale package (WSP) based on the 3D field simulations is presented. It is shown that an assembly plays significant role in the package behavior. Simulation results confirm that the parameters of the package are varying with the change of the assembly-substrate parameters. The approach potentially makes possible to transfer parameters of a transistor corresponding to certain assembly to another assembly without necessity of new measurements. It is very promising in the design of amplifiers namely power amplifiers (PA). (en)
Title
  • 3D Modeling of Assembly Influence on Packaged Transistors
  • 3D Modeling of Assembly Influence on Packaged Transistors (en)
skos:prefLabel
  • 3D Modeling of Assembly Influence on Packaged Transistors
  • 3D Modeling of Assembly Influence on Packaged Transistors (en)
skos:notation
  • RIV/68407700:21230/11:00185041!RIV12-MSM-21230___
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  • Z(MSM6840770015)
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  • 244087
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  • RIV/68407700:21230/11:00185041
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  • electromagnetic modeling; integrated circuit modeling; microwave measurements; millimeter wave measurements; power amplifiers (en)
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  • [82CEE246B885]
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  • Tempe
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  • 78th ARFTG Microwave Measurement Conference Proceedings
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  • Hoffmann, Karel
  • Morávek, Ondřej
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http://linked.open...n/vavai/riv/zamer
number of pages
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  • IEEE Microwave Theory and Techniques Society, US
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  • 978-1-4673-0281-4
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  • 21230
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