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Description
  • Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.
  • Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient. (en)
Title
  • Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile
  • Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile (en)
skos:prefLabel
  • Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile
  • Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile (en)
skos:notation
  • RIV/68407700:21230/11:00182186!RIV12-MSM-21230___
http://linked.open...avai/riv/aktivita
http://linked.open...avai/riv/aktivity
  • Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
http://linked.open.../riv/druhVysledku
http://linked.open...iv/duvernostUdaju
http://linked.open...titaPredkladatele
http://linked.open...dnocenehoVysledku
  • 193160
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/11:00182186
http://linked.open...riv/jazykVysledku
http://linked.open.../riv/klicovaSlova
  • Electrically Conductive Adhesive; Degradation; Curing Process (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [678A434176A6]
http://linked.open...v/mistoKonaniAkce
  • Plzeň
http://linked.open...i/riv/mistoVydani
  • Plzeň
http://linked.open...i/riv/nazevZdroje
  • Applied Electronic 2011
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Tučan, Marek
  • Žák, Pavel
  • Urbánek, Jan
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
http://linked.open...n/vavai/riv/zamer
issn
  • 1803-7232
number of pages
http://purl.org/ne...btex#hasPublisher
  • Západočeská univerzita v Plzni
https://schema.org/isbn
  • 978-80-7043-987-6
http://localhost/t...ganizacniJednotka
  • 21230
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