About: Device for Mechanical Bending of Assembled Printed Circuit Boards

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An Entity of Type : http://linked.opendata.cz/ontology/domain/vavai/Vysledek, within Data Space : linked.opendata.cz associated with source document(s)

Attributes	Values
rdf:type	skos:Concept http://linked.opendata.cz/ontology/domain/vavai/Vysledek
Description	Article deals with design, construction and usage of a device for mechanic bending of assembled printed circuits boards. Device is designed to test the mechanical reliability of SMD components connection on PCB. Device is specifically focused on mechanical tests of solder joints. Article deals with design, construction and usage of a device for mechanic bending of assembled printed circuits boards. Device is designed to test the mechanical reliability of SMD components connection on PCB. Device is specifically focused on mechanical tests of solder joints. (en)
Title	Device for Mechanical Bending of Assembled Printed Circuit Boards Device for Mechanical Bending of Assembled Printed Circuit Boards (en)
skos:prefLabel	Device for Mechanical Bending of Assembled Printed Circuit Boards Device for Mechanical Bending of Assembled Printed Circuit Boards (en)
skos:notation	RIV/68407700:21230/11:00181812!RIV12-MSM-21230___
http://linked.open...avai/riv/aktivita	Z
http://linked.open...avai/riv/aktivity	Z(MSM6840770021)
http://linked.open...vai/riv/dodaniDat	2012
http://linked.open...aciTvurceVysledku	Dušek, Karel
http://linked.open.../riv/druhVysledku	D - Článek ve sborníku
http://linked.open...iv/duvernostUdaju	S - Úplné a pravdivé údaje nepodléhající ochraně podle zvláštních právních předpisů
http://linked.open...titaPredkladatele	České vysoké učení technické v Praze / Fakulta elektrotechnická
http://linked.open...dnocenehoVysledku	194149
http://linked.open...ai/riv/idVysledku	RIV/68407700:21230/11:00181812
http://linked.open...riv/jazykVysledku	eng - angličtina
http://linked.open.../riv/klicovaSlova	device, mechanical bending, solder joint (en)
http://linked.open.../riv/klicoveSlovo	device mechanical bending solder joint
http://linked.open...ontrolniKodProRIV	[43377D3309F3]
http://linked.open...v/mistoKonaniAkce	Brno
http://linked.open...i/riv/mistoVydani	Brno
http://linked.open...i/riv/nazevZdroje	Electronic Devices and Systems, IMAPS CS International Conference 2011 Proceedings
http://linked.open...in/vavai/riv/obor	JA
http://linked.open...ichTvurcuVysledku	1 (xsd:int)
http://linked.open...cetTvurcuVysledku	2 (xsd:int)
http://linked.open...UplatneniVysledku	2011
http://linked.open...iv/tvurceVysledku	Dušek, Karel Gřunděl, J.
http://linked.open...vavai/riv/typAkce	EUR - Evropská
http://linked.open.../riv/zahajeniAkce	2011-06-22 (xsd:date)
http://linked.open...n/vavai/riv/zamer	Characterization of materials
number of pages	4 (xsd:int)
http://purl.org/ne...btex#hasPublisher	Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
https://schema.org/isbn	978-80-214-4303-7
http://localhost/t...ganizacniJednotka	21230

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