About: Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests     Goto   Sponge   NotDistinct   Permalink

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  • This paper presents an overview of climatic experiments attempting to simulate various combinations of operating conditions of electronic device. The main aim of the experiment was to expand our knowledge, which is currently relatively limited where it concerns modern technologies used in electronics. The speed of innovation in this field accelerated To gather knowledge about climatic impacts on reliability, a series of tests were conducted during the course of last two semesters. The specimens of two different electrically conductive adhesives and two lead-free solders, along with an ordinary Sn-Pb solder, were subjected to several types of climatic stress.
  • This paper presents an overview of climatic experiments attempting to simulate various combinations of operating conditions of electronic device. The main aim of the experiment was to expand our knowledge, which is currently relatively limited where it concerns modern technologies used in electronics. The speed of innovation in this field accelerated To gather knowledge about climatic impacts on reliability, a series of tests were conducted during the course of last two semesters. The specimens of two different electrically conductive adhesives and two lead-free solders, along with an ordinary Sn-Pb solder, were subjected to several types of climatic stress. (en)
Title
  • Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests
  • Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests (en)
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  • Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests
  • Propeties of Leadfree Solders and Electrically Conductive Adhesives Subjected to Climatic Tests (en)
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  • RIV/68407700:21230/10:00169662!RIV11-MSM-21230___
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  • 282948
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  • RIV/68407700:21230/10:00169662
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  • Lead-free solder; Electrically conductive adhesive; climate; aging (en)
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http://linked.open...ontrolniKodProRIV
  • [88E1138FAA39]
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  • Brno
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  • Brno
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  • Electronic Devices and Systems, IMAPS CS International Conference 2010 Proceedings
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  • Tučan, Marek
  • Žák, Pavel
  • Urbánek, Jan
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  • Vysoké učení technické v Brně. Fakulta elektrotechniky a informatiky
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  • 978-80-214-4138-5
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  • 21230
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