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  • Unalloyed tin electroplating has a long history of whisker formation that has resulted in reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. Legislation restriction of lead in electronic products sold in the European Union and many other areas of the world has resulted in removing lead from Sn/Pb plating and solder. Using pure tin represents reliability risks due to whisker forming tendencies of tin. The objective of our work is to investigate methods for whisker growth, which can further enable measuring the effectiveness of mitigation strategies. To achieve this objective, a set of experiments was conducted using bright and matte tin platings on brass and bronze coupons and hot-solder dipped bronze coupons.
  • Unalloyed tin electroplating has a long history of whisker formation that has resulted in reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. Legislation restriction of lead in electronic products sold in the European Union and many other areas of the world has resulted in removing lead from Sn/Pb plating and solder. Using pure tin represents reliability risks due to whisker forming tendencies of tin. The objective of our work is to investigate methods for whisker growth, which can further enable measuring the effectiveness of mitigation strategies. To achieve this objective, a set of experiments was conducted using bright and matte tin platings on brass and bronze coupons and hot-solder dipped bronze coupons. (en)
Title
  • Tin Whiskers - Reliability Risk For Electronic Equipment
  • Tin Whiskers - Reliability Risk For Electronic Equipment (en)
skos:prefLabel
  • Tin Whiskers - Reliability Risk For Electronic Equipment
  • Tin Whiskers - Reliability Risk For Electronic Equipment (en)
skos:notation
  • RIV/68407700:21230/09:00157761!RIV10-MSM-21230___
http://linked.open...avai/riv/aktivita
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  • P(OE229)
http://linked.open...vai/riv/dodaniDat
http://linked.open...aciTvurceVysledku
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  • 346383
http://linked.open...ai/riv/idVysledku
  • RIV/68407700:21230/09:00157761
http://linked.open...riv/jazykVysledku
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  • Tin Whiskers; Reliability; Pure Tin (en)
http://linked.open.../riv/klicoveSlovo
http://linked.open...ontrolniKodProRIV
  • [07309BCA9270]
http://linked.open...v/mistoKonaniAkce
  • Stutensee-Blankenloch (Karlsruhe)
http://linked.open...i/riv/mistoVydani
  • Pfinztal (Berghausen)
http://linked.open...i/riv/nazevZdroje
  • Umwelteinflüsse erfassen, simulieren, bewerten
http://linked.open...in/vavai/riv/obor
http://linked.open...ichTvurcuVysledku
http://linked.open...cetTvurcuVysledku
http://linked.open...vavai/riv/projekt
http://linked.open...UplatneniVysledku
http://linked.open...iv/tvurceVysledku
  • Žák, Pavel
http://linked.open...vavai/riv/typAkce
http://linked.open.../riv/zahajeniAkce
number of pages
http://purl.org/ne...btex#hasPublisher
  • Gesellschaft für Umweltsimulation e.V.
https://schema.org/isbn
  • 978-3-9810472-7-1
http://localhost/t...ganizacniJednotka
  • 21230
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